Patent · US Active

System-level packaging structures

US10741499B2 · kind B2 · utility

0Cited by

15References

12Claims

0Family size

Assignee

TONGFU MICROELECTRONICS CO., LTD. · CN

Inventors

Yujuan Tao · Nantong, CN
Lei Shi · Shanghai, CN
Honghui Wang · Beijing, CN

Key dates

Filing date	Nov 28, 2016
Grant date	Aug 11, 2020
Priority date	—
Expiry date	Feb 26, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system-level packaging method includes providing a packaging substrate having a first functional surface and a second surface with wiring arrangement within the packaging substrate and between the first functional surface and the second surface. The method also includes forming at least two package layers on the first functional surface of the packaging substrate, wherein each package layer is formed by subsequently forming a mounting layer, a sealant layer, and a wiring layer. Further, the method includes forming a top sealant layer and planting connection balls on the second functional surface of the packaging substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.