Inventor · Beijing, CN

Honghui Wang

21Patents
2h-index
66Co-inventors
60Inventor score

Filing activity: Jan 30, 1996 → Aug 29, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US8396295B2 Method and system for recognizing a handwritten character Physics 64 Active
US5796003A Acoustic imaging systems Physics 15 Expired
US9140947B2 Array substrate, method for repairing the same and display apparatus Physics 2 Active
USD1057504S1 Bottle warmer General 1 Active
US6628451B2 Acousto-optic reflection-active imaging Physics 1 Expired
US6741382B1 Acousto-optic activity for acoustic imaging Physics 1 Expired
US9379077B2 Metal contact for semiconductor device Electricity 1 Active
US10720450B2 Array substrate and manufacturing method thereof, display panel and display device Physics 1 Active
US6321023A Serial imager for birefringent detector acoustic imaging systems Physics 1 Expired
US12119308B2 Packaging structure of semiconductor chip and formation method thereof Electricity 0 Active
US11761930B2 Prediction method of part surface roughness and tool wear based on multi-task learning Physics 0 Active
US11307471B2 Array substrate, manufacturing method thereof, and display Electricity 0 Active
US11768976B2 Subsea Christmas tree re-prediction method integrating Kalman filter and Bayesian network Emerging Cross-Sectional Technologies 0 Active
US10656292B2 Water pumping and injecting multi-layered concentric sphere neutron spectrometer Physics 0 Active
US9543269B2 System-level packaging methods and structures Electricity 0 Active
US9099448B2 Three-dimensional system-level packaging methods and structures Electricity 0 Active
US12411048B2 Method for locating abnormal temperature event of distributed optical fiber Physics 0 Active
US12175633B1 Method of enhancing abnormal area of ground-penetrating radar image based on hybrid-supervised learning Physics 0 Active
US9837371B2 Structure and method of reinforcing a conductor soldering point of semiconductor device Electricity 0 Active
US9891264B2 Line detecting apparatus and method for array substrate Physics 0 Active
US10741499B2 System-level packaging structures Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.