Resin composition, adhesive layer, and circuit board utilizing same
US10745595B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Jun 28, 2018 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Nov 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.