Conductive agent and module bonding method
US10747072B2 · kind B2 · utility
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Key dates
| Filing date | Aug 22, 2018 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Oct 13, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/1339
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure provides a conductive agent and a module bonding method. In the method, a conductive agent is sprayed to a bonding region. The conductive agent comprising a liquid ultraviolet curable adhesive and conductive particles dispersed in the ultraviolet curable adhesive. A module layer is pre-pressed onto the bonding region with the conductive agent between the module layer and the bonding region. The conductive agent is cured by irradiating the conductive agent with ultraviolet rays and pressurizing the conductive agent, so that the module layer is electrically connected and bonded to the bonding region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.