Inventor · Chandler, AZ, US

Yang Wang

20Patents
5h-index
49Co-inventors
69Inventor score

Filing activity: Sep 12, 1996 → Mar 24, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6156611A Method of fabricating vertical FET with sidewall gate electrode Electricity 170 Expired
US6472278B1 Method and apparatus for creating a voltage threshold in a FET Electricity 121 Expired
US6091621A Non-volatile multistate memory cell using a ferroelectric gate fet Physics 23 Expired
US6057566A Semiconductor device Electricity 14 Expired
US6262451A Electrode structure for transistors, non-volatile memories and the like Emerging Cross-Sectional Technologies 9 Expired
US6262461A Method and apparatus for creating a voltage threshold in a FET Electricity 3 Expired
US10088856B2 Methods and apparatus for negative output voltage active clamping using a floating bandgap reference and temperature compensation Physics 2 Active
US10586791B2 Adaptive thermal overshoot and current limiting protection for MOSFETs Electricity 2 Active
US5856684A High power HFET with improved channel interfaces Electricity 1 Expired
US11892742B2 Method for calibrating controllable phase shifters in multi-stage staggered Mach-Zehnder interferometer on optical chip Physics 0 Active
US11367719B2 Adaptive thermal overshoot and current limiting protection for MOSFETs Electricity 0 Active
US12380811B2 System and method for simulating a respiratory system Physics 0 Active
US10896905B2 Adaptive thermal overshoot and current limiting protection for MOSFETs Electricity 0 Active
US10753885B2 Floor board unit, floor board and IoT home system Electricity 0 Active
US10513414B2 System and method of maintaining performance of a system Physics 0 Active
US12400971B2 Controlling warpage of a substrate for mounting a semiconductor die Electricity 0 Active
US12387705B2 Thin-layer low-frequency underwater sound insulation metamaterial Physics 0 Active
US12349524B2 Semiconductor light source device of optical integrated packaging Electricity 0 Active
US9941697B1 System using a subcircuit shared between capacitors for providing reactive power Emerging Cross-Sectional Technologies 0 Active
US10747072B2 Conductive agent and module bonding method Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.