Power management application of interconnect substrates
US10748845B2 · kind B2 · utility
0Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2019 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | May 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various applications of interconnect substrates in power management systems are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.