Interconnection by lateral transfer printing

US10749093B2 · kind B2 · utility

Assignee

• X Display Company Technology Limited · IE

Inventors

• Matthew Meitl · Durham, US
• Tanya Yvette Moore · Hurdle Mills, US
• Ronald S. Cok · Rochester, US
• Salvatore Bonafede · Chapel Hill, US
• Brook Raymond · Cary, US
• Christopher Bower · Raleigh, US
• Carl Prevatte · Raleigh, US

Key dates

• Filing date: Oct 22, 2019
• Grant date: Aug 18, 2020
• Expiry date: Oct 22, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N30/87
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.