Patent · US Active

Low dielectric constant (DK) and dissipation factor (DF) material for nano-molding technology (NMT)

US10752771B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

SABIC GLOBAL TECHNOLOGIES B.V. · NL

Inventors

Hui Peng · Longbeilingcun, CN
Bing Guan · Shanghai, CN
Wei Shan · Shanghai, CN

Key dates

Filing date	Dec 28, 2018
Grant date	Aug 25, 2020
Priority date	—
Expiry date	Dec 28, 2038

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2207/20
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The disclosure concerns thermoplastic resin compositions including a polymer resin, a dielectric glass fiber component, a hollow glass fiber, and an impact modifier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.