Wafer arrangement

US10753858B2 · kind B2 · utility

Assignees

• Infineon Technologies AG · DE
• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Stefan Kolb · Unterschleißheim, DE
• Alfons Dehe · Reutlingen, DE
• Jochen Huber · Wolfach, DE
• Franz Jost · Stuttgart, DE
• Horst Theuss · Wenzenbach, DE
• Wilhelm Wiedmeier · Augsburg, DE
• Juergen Woellenstein · Glückstadt, DE

Key dates

• Filing date: Jun 28, 2019
• Grant date: Aug 25, 2020
• Expiry date: Jun 28, 2039

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2291/0256
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Shown is a wafer arrangement for a gas sensor including a first substrate and a sescond substrate. The first substrate includes a MEMS membrane associated with a sensor element and an emitter element configured to emit electromagnetic radiation. The second substrate is arranged on top of the first substrate and defines at least a portion of a chamber disposed adjacent to the MEMS membrane.