Method and system for process control with flexible sampling
US10754260B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2016 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Sep 6, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70625
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The generation of flexible sparse metrology sample plans includes receiving a full set of metrology signals from one or more wafers from a metrology tool, determining a set of wafer properties based on the full set of metrology signals and calculating a wafer property metric associated with the set of wafer properties, calculating one or more independent characterization metrics based on the full set of metrology signals, and generating a flexible sparse sample plan based on the set of wafer properties, the wafer property metric, and the one or more independent characterization metrics. The one or more independent characterization metrics of the one or more properties calculated with metrology signals from the flexible sparse sampling plan is within a selected threshold from one or more independent characterization metrics of the one or more properties calculated with the full set of metrology signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.