Multi-layer plasma erosion protection for chamber components
US10755900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2018 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Nov 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0203
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of applying a multi-layer plasma resistant coating on an article comprises performing plating or ALD to form a conformal first plasma resistant layer on an article, wherein the conformal first plasma resistant layer is formed on a surface of the article and on walls of high aspect ratio features in the article. The conformal first plasma resistant coating has a porosity of approximately 0% and a thickness of approximately 200 nm to approximately 1 micron. One of electron beam ion assisted deposition (EB-IAD), plasma enhanced chemical vapor deposition (PECVD), aerosol deposition or plasma spraying is then performed to form a second plasma resistant layer that covers the conformal first plasma resistant layer at a region of the surface but not at the walls of the high aspect ratio features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.