Electrical connection structure, semiconductor package and method of forming the same
US10755993B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2017 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Mar 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments may provide an electrical connection structure. The electrical connection structure may include a first substrate having a first surface defining a cavity, and an inner wall defining a via extending from the cavity. The electrical connection structure may also include an interconnect structure provided in the via so that at least a portion of the interconnect structure protrudes into the cavity. The electrical connection structure may further include a second substrate having a second surface facing the first surface. The electrical connection structure may additionally include a connection element on the second surface. At least a portion of the connection element may be received in the cavity so that the connection element is in electrical connection with the interconnect structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.