Decoupling capacitor stiffener

US10756031B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Charles L. Arvin · Savannah, US
• Franklin M. Baez · Fishkill, US
• Brian W. Quinlan · Poughkeepsie, US
• Charles L. Reynolds · Red Hook, US
• Krishna R. Tunga · Wappingers Falls, US
• Thomas Weiss · Poughkeepsie, US

Key dates

• Filing date: May 10, 2019
• Grant date: Aug 25, 2020
• Expiry date: May 10, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19105
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An IC device carrier includes organic substrate layers and wiring line layers therein. To reduce stain of the organic substrate layers and to provide decoupling capacitance, one or more decoupling capacitor stiffeners (DCS) are applied to the top side metallization (TSM) surface of the IC device carrier. The DCS(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the organic substrate layers, thereby mitigating the risk for cracks forming and expanding or other damage within the carrier. The DCS(s) also include two or more capacitor plates and provides capacitance to electrically decouple electrical subsystems of the system of which the DCS is apart.