Finned contact
US10756041B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2019 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Mar 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A finned contact of an IC device may be utilized to electrically connect the IC device to external circuitry. The finned contact may be fabricated by forming a base upon the IC device and subsequently forming two or more fins upon the base. Each fin may be formed of the same and/or different material(s) as the base. Each fin may include layer(s) of one or materials. The fins may be located upon the base inset from the sidewall(s) of the base. The fins may be arranged as separated ring portions that are concentric with the base. The fins may drive current into the external circuitry connected thereto. Solder may be drawn towards the center of the base within an inner void that is internal to the fins, thereby limiting the likelihood of solder bridging with a neighboring contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.