Heat shock protein binding compounds, compositions, and methods for making and using same
US10758538B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2018 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Jul 17, 2038 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61K2121/00
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
The present subject matter relates to a compound represented by the general formula (I) or (I′) or a pharmacologically acceptable salt thereof; pharmaceutical compositions containing at least one of these compounds; methods of making at least one of these compounds; methods of using at least one of these compounds for treating and/or preventing various cancers and/or proliferation disorders; methods of using at least one of these compounds for monitoring the effectiveness of an anticancer therapy against various cancers. In one embodiment, the subject matter relates to compounds that bind with a level of specificity to heat shock protein 70 (Hsp70). In another embodiment, the subject matter relates to compounds that bind with a level of specificity to inhibit both heat shock protein 70 (Hsp70) and heat shock cognate protein 70 (Hsc70).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.