MEMS sensor with dual pendulous proof masses
US10759656B2 · kind B2 · utility
1Cited by
7References
12Claims
0Family size
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Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0837
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A MEMS sensor is disclosed that includes dual pendulous proof masses comprised of sections of different thickness to allow simultaneous suppression of vertical and lateral thermal gradient-induced offsets in a MEMS sensor while still allowing for the normal operation of the accelerometer. In an embodiment, the structure and different sections of the MEMS sensor is realized using multiple polysilicon layers. In other embodiments, the structure and different thickness sections may be realized with other materials and processes. For example, plating, etching, or silicon-on-nothing (SON) processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.