Stress isolation platform for MEMS devices
US10759659B2 · kind B2 · utility
5Cited by
114References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2018 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Oct 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.