Sensor package, method of manufacturing the same, and method of manufacturing lid structure
US10760930B2 · kind B2 · utility
1Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2018 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Feb 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15174
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.