Eunhee Jung
8Patents
1h-index
13Co-inventors
40Inventor score
Filing activity: Aug 23, 2018 → Apr 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11067554B2 | Gas sensor package and sensing apparatus including the same | Electricity | 1 | Active |
| US11125734B2 | Gas sensor package | Electricity | 1 | Active |
| US11367679B2 | Semiconductor package including an in interposer and method of fabricating the same | Electricity | 1 | Active |
| US12062605B2 | Semiconductor package including an interposer and method of fabricating the same | Electricity | 1 | Active |
| US10760930B2 | Sensor package, method of manufacturing the same, and method of manufacturing lid structure | Electricity | 1 | Active |
| US11131568B2 | Sensor package, method of manufacturing the same, and method of manufacturing lid structure | Electricity | 0 | Active |
| US11658107B2 | Semiconductor package including an interposer and method of fabricating the same | Electricity | 0 | Active |
| US10923428B2 | Semiconductor package having second pad electrically connected through the interposer chip to the first pad | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.