System and method for electrical behavior modeling in a 3D virtual fabrication environment
US10762267B2 · kind B2 · utility
2Cited by
15References
20Claims
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Key dates
| Filing date | May 30, 2017 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Feb 2, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Modeling of electrical behavior during the virtual fabrication of a semiconductor device structure is discussed. Electrical behavior occurring in a designated region of a semiconductor device structure may be determined during the virtual fabrication process. For example, resistance or capacitance values may be determined within a modeling domain of interest.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.