Patent · US Active

Integrated elastomeric interface layer formation and singulation for light emitting diodes

US10763135B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

Facebook Technologies, LLC · US

Inventors

Pooya Saketi · Cork, IE
Karsten Moh · Riegelsberg, DE
Tilman Zehender · Cork, IE

Key dates

Filing date	Jan 30, 2018
Grant date	Sep 1, 2020
Priority date	—
Expiry date	Jan 30, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/034
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments relate to an integrated process for forming an elastomeric layer over an epitaxial structure of multiple light emitting diode (LED) dies, and then etching the elastomeric layer into individual elastomeric interface layers (elayers) on each of the LED dies and etching the epitaxial structure to singulate the LED dies. The elayer allows each LED die to be picked up by a pick-up head (or pick and place head (PPH)), and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (uLED) dies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.