Electrical devices and methods for forming electrical devices
US10763218B2 · kind B2 · utility
2Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2016 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Mar 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.