Boping Wu
7Patents
2h-index
12Co-inventors
44Inventor score
Filing activity: Sep 29, 2006 → Sep 14, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8913364B2 | Decoupling arrangement | Electricity | 2 | Active |
| US10763218B2 | Electrical devices and methods for forming electrical devices | Electricity | 2 | Active |
| US9225164B2 | Decoupling arrangement | Electricity | 1 | Active |
| US7649265B2 | Micro-via structure design for high performance integrated circuits | Electricity | 0 | Active |
| US9750129B2 | Absorbing termination in an interconnect | Electricity | 0 | Active |
| US10015878B2 | Decoupling arrangement | Electricity | 0 | Active |
| US9485854B2 | Absorbing termination in an interconnect | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.