Patent · US Active

Embedding component with pre-connected pillar in component carrier

US10765005B2 · kind B2 · utility

1Cited by

2References

11Claims

0Family size

Assignee

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft · AT

Inventors

Hannes Stahr · Kindberg, AT
Hannes Voraberger · Graz, AT
Andreas Zluc · Leoben, AT
Bettina Schuster · Leoben, AT

Key dates

Filing date	Oct 24, 2018
Grant date	Sep 1, 2020
Priority date	—
Expiry date	Oct 24, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1189
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.