Semiconductor element and methods for manufacturing the same

US10766769B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Christian Bretthauer · Munich, DE
• Dirk Meinhold · Dresden, DE

Key dates

• Filing date: Mar 22, 2018
• Grant date: Sep 8, 2020
• Expiry date: Dec 4, 2038

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2207/07
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A semiconductor element includes a processed substrate arrangement including a processed semiconductor substrate and a metallization layer arrangement on a main surface of the processed semiconductor substrate. The semiconductor element further includes a passivation layer arranged at an outer border of the processed substrate arrangement.