Semiconductor wafer device and manufacturing method thereof
US10770331B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2018 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Aug 20, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor device includes a carrier having a first central axis extending along a first direction and a second central axis extending along a second direction, a plurality of dies disposed on a surface of the carrier, and a plurality of scribing lines separating the plurality of dies from each other. The plurality of scribing lines include a plurality of continuous lines along the first direction and a plurality of discontinuous lines along the second direction, at least one of the plurality of continuous lines overlaps the first central axis, at least one of the plurality of discontinuous lines overlaps the second central axis. The plurality of dies are symmetrically arranged on the carrier about the first central axis and the second central axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.