Fan-out semiconductor packaging structure with antenna module and method making the same
US10770394B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2018 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Dec 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application provides a fan-out semiconductor packaging structure with an antenna module and a method making the same. The fan-out semiconductor packaging structure with the antenna module comprises: a semiconductor chip; a plastic packaging material layer enclosing a periphery of the semiconductor chip; a filling structure disposed in the plastic packaging material layer and disposed on the periphery of the semiconductor chip, a loss caused by the filling structure to an antenna signal is smaller than a loss caused by the plastic packaging material layer to an antenna signal; an antenna module disposed on the first surface of the plastic packaging material layer, an orthographic projection of the antenna module on the filling structure is disposed on the filling structure; a redistribution layer disposed on the second surface of the plastic packaging material layer; and a solder bump disposed on a surface of the redistribution layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.