Microelectronic device stacks having interior window wirebonding
US10770429B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2016 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Jun 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic package may be fabricated having a microelectronic die stack attached to a microelectronic substrate, wherein a first microelectronic die within the microelectronic die stack includes an opening or “window” formed therethrough. The first microelectronic die may be in electronic communication with a second microelectronic die within microelectronic die stack and/or in electrical communication with a microelectronic substrate upon which the microelectronic die stack may be attached, wherein the electronic communication may be created with a bond wire which extends through the opening or “window” in the first microelectronic die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.