Cory A. Runyan
4Patents
1h-index
5Co-inventors
37Inventor score
Filing activity: Feb 11, 1999 → Oct 28, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6075690A | Relay multiplexer system and method for improved debounce of relays | Electricity | 2 | Expired |
| US9917041B1 | 3D chip assemblies using stacked leadframes | Electricity | 1 | Active |
| US11562955B2 | High density multiple die structure | Electricity | 0 | Active |
| US10770429B2 | Microelectronic device stacks having interior window wirebonding | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.