Wideband termination for high power applications
US10772193B1 · kind B1 · utility
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3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2019 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Dec 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wideband termination circuit layout is provided for high power applications. The circuit layout may include a dielectric layer having a first surface and a second surface. The circuit layout may also include an input port disposed over the first surface. The circuit layout may further include at least two resistive film patches disposed over the first surface of the dielectric layer and a tuning line between the at least two resistive films disposed over the first surface of the dielectric layer. The at least two resistive film patches are connected in series with the at least one tuning line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.