TTM Technologies, Inc.
🏢 View company profile →16Patents
14Active
16Granted
44Portfolio score
Filing activity: Sep 10, 2001 → Oct 13, 2022 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6586687B2 | Printed wiring board with high density inner layer structure | Emerging Cross-Sectional Technologies | 7 | Expired |
| US11158920B2 | High powered RF part for improved manufacturability | Electricity | 1 | Active |
| US11711885B2 | Method of manufacturing printed circuit board assemblies with engineered thermal paths | Electricity | 0 | Active |
| US11277909B2 | Three-dimensional circuit assembly with composite bonded encapsulation | Electricity | 0 | Active |
| US11997800B2 | Systems and methods for removing undesired metal within vias from printed circuit boards | Electricity | 0 | Active |
| US10772193B1 | Wideband termination for high power applications | Electricity | 0 | Active |
| US11362407B2 | Directional couplers with DC insulated input and output ports | Electricity | 0 | Active |
| US7240313B2 | Method for analyzing material density variations on a multi-layer printed circuit board | Electricity | 0 | Expired |
| US11406008B2 | Wideband termination for high power applications | Electricity | 0 | Active |
| US12418085B2 | Circulator design and methods of fabricating the circulator | Electricity | 0 | Active |
| US12176592B2 | High powered RF part for improved manufacturability | Electricity | 0 | Active |
| US11729933B2 | Near-hermetic package with flexible signal input and output | Electricity | 0 | Active |
| US10980127B2 | Methods for fabricating printed circuit board assemblies with high density via array | Electricity | 0 | Active |
| US11693181B2 | High-density optical waveguide structure and printed circuit board and preparation method thereof | Electricity | 0 | Active |
| US8444770B2 | System for cleaning components for filling holes in a printed circuit board with a fluid fill material | Electricity | 0 | Active |
| US8122847B2 | System for filling holes in a printed circuit board with a fluid fill material | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.