Method, apparatus, and assembly for thermally connecting layers
US10777483B1 · kind B1 · utility
2Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2020 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | May 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3736
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die of an integrated circuit and an upper layer of a circuit assembly are thermally connected by applying a thermal interface material (TIM) on the die, such that the TIM is between the die and an upper layer. The TIM comprises an emulsion of liquid metal droplets and uncured polymer. The method further comprises compressing the circuit assembly thereby deforming the liquid metal droplets and curing the thermal interface material thereby forming the circuit assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.