ARIECA INC.
3Patents
3Active
3Granted
46Portfolio score
Filing activity: May 13, 2020 → Dec 1, 2023
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10777483B1 | Method, apparatus, and assembly for thermally connecting layers | Electricity | 2 | Active |
| US11335622B2 | Method, apparatus, and assembly for thermally connecting layers | Electricity | 1 | Active |
| US12027442B1 | Thermal interface material, an integrated circuit formed therewith, and a method of application thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.