Fan-out antenna packaging structure and preparation method thereof
US10777515B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2018 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Oct 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/96
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a fan-out antenna packaging structure and a preparation method thereof. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer enclosing a periphery of the semiconductor chip, a via being formed in the plastic packaging material layer; a conductive pole located in the via and running through the plastic packaging material layer from top to bottom; an antenna structure located on a first surface of the plastic packaging material layer and electrically connected with the conductive pole; a redistribution layer located on a second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the conductive pole; and a solder bump located on a surface of the redistribution layer, electrically connected with the redistribution layer and insulated from the plastic packaging material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.