Electrochemical removal of aluminum nitride substrates for electronic and optoelectronic devices
US10777706B2 · kind B2 · utility
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2References
40Claims
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Assignee
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Key dates
| Filing date | Oct 16, 2018 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Oct 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/032
Abstract
In various embodiments, an electrochemical process is utilized to remove at least a portion of a substrate from multiple singulated or unsingulated electronic-device or optoelectronic-device dies. The dies may be attached to a submount for the removal process, and the dies may be immersed in or non-immersively contact an electrolyte during the removal process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.