Printed circuit board
US10779409B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2019 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Nov 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.