Method of embedding a component in a printed circuit board
US10779413B2 · kind B2 · utility
6Cited by
56References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2014 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Apr 29, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.