Patent · US Active

Material dispensing and compaction in additive manufacturing

US10780497B2 · kind B2 · utility

4Cited by

16References

15Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Hou T. Ng · Campbell, US
Nag B. Patibandla · Pleasanton, US
Ajey M. Joshi · San Jose, US
Ashavani Kumar · Sunnyvale, US
Kasiraman Krishnan · Clifton Park, US

Key dates

Filing date	Jun 17, 2016
Grant date	Sep 22, 2020
Priority date	—
Expiry date	Feb 14, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P10/25
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

An additive manufacturing apparatus for forming a part includes a support, a first dispenser to deliver a layer of first particles on a support or an underlying layer on the support, a second dispenser to deliver second particles onto the layer of first particles such that the second particles infiltrate into the layer of first particles, an energy source to fuse the first particle and second particles to form a fused layer of the part, and a controller coupled to the first dispenser, second dispenser and energy source.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.