Method and device for estimating level of damage or lifetime expectation of power semiconductor module
US10782338B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2017 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Aug 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method estimates a level of damage or a lifetime expectation of a power semiconductor module having at least one die that is mechanically and electrically attached to a ceramic substrate. The ceramic substrate has piezoelectric properties and the method includes: controlling the at least one power die, the control of the at least one power die generating changes in the electrical potential across the ceramic substrate; obtaining information representative of a mechanical deformation of the ceramic substrate; determining if a notification indicating the level of damage or the lifetime expectation has to be performed according to the obtained information and reference information; and notifying the level of damage or the lifetime expectation if the determining step determines that the notification has to be performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.