Chemical mechanical polishing apparatus
US10784113B2 · kind B2 · utility
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6References
9Claims
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Assignee
Inventor
Key dates
| Filing date | Aug 8, 2016 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Aug 8, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a chemical mechanical polishing apparatus and a control method thereof. The chemical mechanical polishing apparatus includes a plurality of polishing platens provided with a polishing pad on an upper surface thereof, and a polishing platen transferring unit for transferring the plurality of polishing platens to different process positions according to a predetermined process sequence. Here, different processes are performed at different process positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.