Optical module, fabrication method thereof, and terminal device using the same
US10784298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2019 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Jun 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.