Body tie optimization for stacked transistor amplifier
US10784818B2 · kind B2 · utility
9Cited by
33References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2019 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Jun 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/75
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.