Integrated circuit package element and load board thereof
US10790223B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 29, 2019 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Jun 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package element provided includes a chip element and a package module coupled to the chip element. The chip element includes two driving units that are electrically connected to each other. The package module includes a grounding area, two individual power distributed networks and a grounded shielding structure which is completely disposed between the individual power distributed networks, electrically connected to the chip element, and configured to block power noise coupling between the first electric power distribution network and the second electric power distribution network. The grounding area is electrically connected to the individual electric power distribution networks and the grounded shielding structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.