Yu-Cheng Sun
6Patents
1h-index
9Co-inventors
33Inventor score
Filing activity: Feb 15, 2019 → Mar 11, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10736209B2 | Circuit board structure and conductive transmission line structure thereof | Electricity | 1 | Active |
| US11600572B2 | Routing structure between dies and method for arranging routing between dies | Electricity | 0 | Active |
| US11309936B2 | Signal transmission device | Electricity | 0 | Active |
| US11335631B2 | Power delivery device and method | Electricity | 0 | Active |
| US10790223B2 | Integrated circuit package element and load board thereof | Electricity | 0 | Active |
| US10892238B2 | Circuit structure and chip package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.