Wiring substrate and electronic device
US10790236B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2019 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Apr 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05557
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes a first substrate including a wiring layer and a solder resist layer that partially covers the wiring layer. The solder resist layer includes a circular opening partially exposing the wiring layer and a support partially covering the wiring layer within the opening. The wiring layer includes a first connection pad exposed in the opening and formed by a portion of the wiring layer located at an outer side of the support. The wiring substrate further includes a cylindrical connection pin and a bonding member that bonds a first end surface of the connection pin and the first connection pad located in the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.