Sachiko Oda
7Patents
2h-index
31Co-inventors
51Inventor score
Filing activity: Dec 8, 1999 → Aug 16, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7435680B2 | Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure | Electricity | 29 | Expired |
| US6604154B1 | Data processing device | Physics | 5 | Expired |
| US6647442B1 | Data processing device | Physics | 2 | Expired |
| US11099804B2 | Panel driver interface systems and methods for electronic device displays | Physics | 1 | Active |
| US7807560B2 | Solder bump forming method | Electricity | 0 | Active |
| US11810494B2 | Dither enhancement of display gamma DAC systems and methods | Electricity | 0 | Active |
| US10790236B2 | Wiring substrate and electronic device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.