Electronic element inspection equipment and chip inspection method thereof
US10794951B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 24, 2018 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Feb 9, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2867
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic element inspection equipment is provided, which is adapted to inspect an electronic element. The electronic element inspection equipment includes a first transmission track, a first rotational unit, a first image capturing device, a second image capturing device, a third image capturing device, a second rotational unit, a fourth image capturing device, and a second transmission track. The first rotational unit rotates around a first axis. When the first rotational unit moves the electronic element, the first image capturing device, the second image capturing device, and the third image capturing device capture images of the electronic element. The second rotational unit rotates around a second axis, wherein the second axis is perpendicular to the first axis. When the second rotational unit moves the electronic element, the fourth image capturing device captures one image of the electronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.