3D depth map
US10795022B2 · kind B2 · utility
5Cited by
36References
13Claims
0Family size
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Key dates
| Filing date | May 9, 2017 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | May 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N13/271
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Machine learning is applied to both 2D images from an infrared imager imaging laser reflections from an object and to the 3D depth map of the object that is generated using the 2D images and time of flight (TOF) information. In this way, the 3D depth map accuracy can be improved without increasing laser power or using high resolution imagers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.