Substrate processing apparatus and substrate processing method
US10796891B2 · kind B2 · utility
7Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2018 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Oct 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/24564
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate processing apparatus including a chamber having a processing space inside, a support unit that supports a substrate in the processing space, a gas supply unit that supplies gas into the processing space, a plasma source that generates plasma from the gas supplied into the processing space, and a detection unit that is provided in a sidewall of the chamber and that measures an impedance change to detect a degree of adsorption of particles on an inner wall of the chamber or a surface of a part that is exposed to the processing space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.