Semiconductor package
US10797031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2018 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Jan 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1437
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a first optical transceiver, a second optical transceiver, a third optical transceiver, and a plasmonic waveguide. The first optical transceiver includes at least one optical input/output portion for transmitting and receiving optical signal. The second optical transceiver is stacked on the first optical transceiver. The third optical transceiver includes at least one optical input/output portion for transmitting and receiving optical signal. The third optical transceiver is stacked on the second optical transceiver. The plasmonic waveguide penetrates through the second optical transceiver and optically couples the at least one optical input/output portion of the first optical transceiver and the at least one optical input/output portion of the third optical transceiver.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.